Optical communication CuW products - electronic packaging heat dissipation material
Optical Module is a very important active device in 5G communication equipment. It is composed of Optical devices, functional circuits and Optical interfaces. The main function is to complete the photoelectric electro-optical conversion of optical signal. It is mainly used for telecom transmission, data center and 5G base station. The module has three core parts, optical chip, laser and optical prism; These three components have harsh requirements on the heat dissipation coefficient and thermal expansion coefficient of the carrier material, which is called optical chip base.
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产品介绍
通过调整成分可调整产品性能，低膨胀性及高导热性。主要采用模压、注射成型、多线切割、3D打印等工艺。
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材质：
CuW
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工艺：
模压、注射成型等
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特点：
产品性能可调
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应用领域：
5G通讯设备
光模块
能满足 100G以上速率光模块性能要求的基座材料只有可伐合金( Kovar）和 钨铜合金(CuW )、钼铜(CuMo)。200G/400G光模块则必须使用CuW光芯片基座来保证散热。CuW合金既有钨的低膨胀特性，又具有铜的高导热特性，其热膨胀系数和导电导热性可以通过调整材料的成分而加以改变。
产品参数
应用案例
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